All high-profile components are mounted on one side, to minimise volume wastage.
Note the use of edge plating to provide connections to the inner ground plane around the edge of the board. This method has reduced the number of vias by about 30, increasing the available board area.
This board is assembled in moderate quantities, on small, low-cost automatic placement machines. To ensure a high production yield without the need for special equipment or techniques, 0402 components have been avoided and component spacing is generous.
The boards are manufactured in panels of 20.
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